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PCB Manufacture Technology

   
 

PCB Manufacture Performance

 
Engineering

 

 
Attributes Layer Count 80L
Max. Board Thickness 7.4T
Max. Panel Size 610 * 720mm
Small Via Hole /Aspect Ratio Standard 26
Advance / Prototype 32 / 41
Trace & Space External (1.5oz) 2.5 / 3.0mil
Internal (0.5oz) 2.0 / 2.5mil
Pitch Min BGA Pitch 0.25mm
Build-Up Via Structure Sequentia Lamination 40-N-4 LVH+IVH
Flatness Warpage 0.25mm
D2M Drill to Copper 0.3mil

 

 

 

   
 

Handling PCB raw Materials

   
 
Maker High Multi Layer Mass Production Under Qual or Plan Under Review
Doosan DS7***S(N)
DS7***D**(X)
DS7***S(F)
DS7***H
- DS7***9D,DS7***9D(Z)
DS7***2D
iSola - 3***R, FR**6
FR**8 / HR, IS***i
- IS4**, IS6**
Panasonic Me*****4
Me*****6
R1***V
R1***T
Me*****2
Me*****7
R2***
ITEQ - IT18* / A, IT15* IT1**DA IT18*I, IT17**R, IT2***K
IT15*D, IT1**DASE/_L
tuc - TU72*, TU76*
TU8***F, TU8**LF/SLK
- TU***K Sp
MGC - - H*-6**G
F*-2
E*-1**T, E*2-**T
F*-7**
P N4***-*3/SI
N4***-*2/SI
N4***-6
N7***-*2HT
- N4***-20
ROGERS - RO4***B, RO3***
RO4***C
- RO***/6

 

 

 

   
 

LDI(Laser Direct Image)

   
 
최소 패터폭 30㎛
Resolution 2.5㎛
Light Source UV 반도체 레이저
최대 제품사이즈 520*620mm
최대 노광면적 515*615mm
최대 제품두께 3.0mm (반자동 5.0mm)
특징 패턴 형성 정밀도 우수

 

 

 

   
 

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