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LSI Test Solution

Final Test Board

Wafer Test Board

Mother Board(PRVX)

Product Capabilities

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Wafer Test Board

T2000, T2K PIB (Advantest)

Max Layer	~54 Layer
Thickness	4.8mm
Material	FR-4, Nelco, Isora, Panasonic
Size	550*480
Option	HPL, BVH, Back Drill, Build Up
Impedance Control	50, 90, 100ohm ±10% (7%, 5%)
Max Dut	~8DUT

UltraFLEX Ultrapin1600 (XD,XC,SC,HD) PIB (Teradyne)

Max Layer	~68 Layer
Thickness	6.35mm
Material	FR-4, Nelco, Isora, Panasonic
Size	406*406
Option	HPL, BVH, Back Drill, Build Up
Impedance Control	50, 90, 100ohm ±10% (7%, 5%)
Max Dut	~8DUT

UltraFLEX (XD,XC,SC,HD) PIB (Teradyne)

Max Layer	~54 Layer
Thickness	4.8mm
Material	FR-4, Nelco, Isora, Pansonic
Size	406*406
Option	HPL, BVH, Back Drill, Build Up
Impedance Control	50, 90, 100ohm ±10% (7%, 5%)
Max Dut	~8DUT

FLEX & microFLEX PIB (Teradyne)

Max Layer	~54 Layer
Thickness	4.8mm
Material	FR-4, Nelco, Isora, Panasonic
Size	406*406
Option	HPL, BVH, Back Drill, Build Up
Impedance Control	50, 90, 100ohm ±10% (7%, 5%)
Max Dut	~8DUT

Catalyst PIB (Teradyne)

Max Layer	~54 Layer
Thickness	3.2mm / 4.8mm
Material	FR-4, Nelco, Isora, Panasonic
Size	343*385
Option	HPL, BVH, Back Drill, Build Up
Impedance Control	50, 90, 100ohm ±10% (7%, 5%)
Max Dut	~8DUT

HP9300, V93K PIB (Advantest)

Max Layer	~54 Layer
Thickness	4.8mm
Material	FR-4, Nelco, Isora, Panasonic
Size	582*430
Option	HPL, BVH, Back Drill, Build Up
Impedance Control	50, 90, 100ohm ±10% (7%, 5%)
Max Dut	~8DUT

IP750 P'C (EMP / EX)

Max Layer	~54 Layer
Thickness	4.8mm
Material	FR-4, Nelco, Isora, Panasonic
Size	305*305
Option	HPL, BVH, Back Drill, Build Up
Impedance Control	50, 90, 100ohm ±10% (7%, 5%)
Max Dut	~8DUT