Design 제품군 (Tester 기준)

	Teradyne UltraFLEX UltraPin1600 UltraFLEX UltraPin800 FLEX & microFLEX Tiger Catalyst Advantest T2000 EPP, T2P T2000 V9300, V93K     Other Quartet Fusion J750 / IP750 Magnum D-10

 

 

 

	Design TAT

	2 Para 4 Para 8 Para 16 Para AP 제품군 2 week 2.5 week 4 week 6 week Other 제품군 1 week 2 week 2.5 week 4 week

 

 

 

	Manufacture TAT

	3.2T 4.8T 6.35T Normal 7 day Normal 8 day Normal 10 day HPL 9 day HPL 10 day HPL 15 day 0.4 / 0.35 Pitch 14 day 0.4 / 0.35 Pitch 18 day 0.4 / 0.35 Pitch 25 day

 

 

 

	Manufacture Specification

Item Standard Advanced Engineering Max. Layer Counts 48 62 62+ Max. Board Thickness (mm) 4.8 6.35 6.35+ Min. Core Thickness (mm) 0.05 0.05 0.025 Max. Board Size (mm) 610*660 610*720 610*720 Trace & Space Inner (mm) 0.075/0.075 0.06/0.06 0.05/0.05 Outer(mm 0.09/0.09 0.07/0.07 0.06/0.06 Registration Budget (mm) 0.075 0.075 0.065 Min. Drilled Via Size (mm) 0.15 0.125 0.1 Aspect Ratio 14 26 33 Copper Weights Min Outer (oz) 1/2 1/2 1/3 Min Inner (oz) 1/2 1/2 1/3 Max Inner (oz) 1 1 2 Max Outer (0z) 2 2 3 HPL(Hole Plugging Land)=POV(Pad on Via) N-CVF N-CVF N-CVF Via Fill / Cap Plate   & & CVF = Conductive Via Fill   CVF CVF N-CVF=Non-conductive Via Fill       Drill to Copper DUT Area (mm) 0.1 0.075 0.07 Other Area (mm) 0.15 0.125 0.125 Circuit(Plane) to PCB edge (mm) 0.5 0.5 0.3 Routing Tolerance (mm) ±0.2 ±0.125 ±0.1 Solder Mask Dam (mm) Min 0.125 Min 0.125 Min 0.1 Blind Mechanical Vias (mm) 0.15 0.125 0.1 Buried Mechanical Vias (mm) 0.15 0.125 0.1 Laser Drilled Microvias (mm) 0.125 0.125 0.1 Mechanical Depth Drilled Vias Yes Yes Yes Back Drill (Pitch) 0.65 0.5 0.4 Back Drill Depth Tolerance (mm) ±0.2 ±0.15 ±0.1 Stacked MicroVias 1+1 1+1, 2+2 1+1, 2+2 Filled Microvias CVF=Conductive Via Fill N-CVF=Non-conductive Via Fill N-CVF N-CVF N-CVF Sequential Lamination Yes Yes Yes Impedance Control Inner ±10% ±8% ±5% Outer ±10% ±10% ±7% Surface Finish E-less Nickel Immersion Gold Ni 3~8㎛ Flash Au 0.03~0.07㎛ Heavy Au 0.1~0.7㎛ Electrolytic Nickel Hard Gold Ni 3~15㎛ (Selective Gold) Au 0.1~1.5㎛ HASL 3~25㎛

 

 

 

	Controlled Impedance

	Impedance Single-ended 50~110 ohm Differential 100~150 ohm Impedance Tolerance 50 ohm 10% (7%, 5%) 90 ohm 10% 100 ohm 10% Impedance Type Single-ended Micro, Dual, Symmetrical, Embedded Differential Micro, Symmetrical, Dual, Embedded, Broadside coupled Coplanar Micro, Symmetrical, Dual, Embedded