gnb 마우스 오버시 배경

HOME > LSI Test Solution > Product Capabilities

Product Capabilities

   
 

Design 제품군 (Tester 기준)

   
 
Teradyne UltraFLEX UltraPin1600 UltraFLEX UltraPin800 FLEX & microFLEX Tiger Catalyst
Advantest T2000 EPP, T2P T2000 V9300, V93K    
Other Quartet Fusion J750 / IP750 Magnum D-10

 

 

 

 

   
 

Design TAT

   
 
  2 Para 4 Para 8 Para 16 Para
AP 제품군 2 week 2.5 week 4 week 6 week
Other 제품군 1 week 2 week 2.5 week 4 week

 

 

 

 

   
 

Manufacture TAT

   
 
3.2T 4.8T 6.35T
Normal 7 day Normal 8 day Normal 10 day
HPL 9 day HPL 10 day HPL 15 day
0.4 / 0.35 Pitch 14 day 0.4 / 0.35 Pitch 18 day 0.4 / 0.35 Pitch 25 day

 

 

 

 

   
 

Manufacture Specification

   
 
Item Standard Advanced Engineering
Max. Layer Counts 48 62 62+
Max. Board Thickness (mm) 4.8 6.35 6.35+
Min. Core Thickness (mm) 0.05 0.05 0.025
Max. Board Size (mm) 610*660 610*720 610*720
Trace & Space Inner (mm) 0.075/0.075 0.06/0.06 0.05/0.05
Outer(mm 0.09/0.09 0.07/0.07 0.06/0.06
Registration Budget (mm) 0.075 0.075 0.065
Min. Drilled Via Size (mm) 0.15 0.125 0.1
Aspect Ratio 14 26 33
Copper Weights Min Outer (oz) 1/2 1/2 1/3
Min Inner (oz) 1/2 1/2 1/3
Max Inner (oz) 1 1 2
Max Outer (0z) 2 2 3
HPL(Hole Plugging Land)=POV(Pad on Via) N-CVF N-CVF N-CVF
Via Fill / Cap Plate   & &
CVF = Conductive Via Fill   CVF CVF
N-CVF=Non-conductive Via Fill      
Drill to Copper DUT Area (mm) 0.1 0.075 0.07
Other Area (mm) 0.15 0.125 0.125
Circuit(Plane) to PCB edge (mm) 0.5 0.5 0.3
Routing Tolerance (mm) ±0.2 ±0.125 ±0.1
Solder Mask Dam (mm) Min 0.125 Min 0.125 Min 0.1
Blind Mechanical Vias (mm) 0.15 0.125 0.1
Buried Mechanical Vias (mm) 0.15 0.125 0.1
Laser Drilled Microvias (mm) 0.125 0.125 0.1
Mechanical Depth Drilled Vias Yes Yes Yes
Back Drill (Pitch) 0.65 0.5 0.4
Back Drill Depth Tolerance (mm) ±0.2 ±0.15 ±0.1
Stacked MicroVias 1+1 1+1, 2+2 1+1, 2+2
Filled Microvias
CVF=Conductive Via Fill
N-CVF=Non-conductive Via Fill
N-CVF N-CVF N-CVF
Sequential Lamination Yes Yes Yes
Impedance Control Inner ±10% ±8% ±5%
Outer ±10% ±10% ±7%
Surface Finish E-less Nickel Immersion Gold Ni 3~8㎛
Flash Au 0.03~0.07㎛
Heavy Au 0.1~0.7㎛
Electrolytic Nickel Hard Gold Ni 3~15㎛
(Selective Gold) Au 0.1~1.5㎛
HASL 3~25㎛

 

 

 

 

   
 

Controlled Impedance

   
 
Impedance Single-ended 50~110 ohm
Differential 100~150 ohm
Impedance Tolerance 50 ohm 10% (7%, 5%)
90 ohm 10%
100 ohm 10%
Impedance Type Single-ended Micro, Dual, Symmetrical, Embedded
Differential Micro, Symmetrical, Dual, Embedded, Broadside coupled
Coplanar Micro, Symmetrical, Dual, Embedded