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Product Technology

 

   
 

Hi-Fix Design

   
 

- Prior verification of impedance PI/SI optimized performance with a design using simulation and analysis of high speed signal characteristics and applied this to design.
- Inform recption and automaic import application during PCB Design applicaton by using a Self-developed program.
(Blocking faulty mapping and fault PPS)
- Possession and operation of various CADs including Allegro, P-cad, AutoCAD compatible with all data.
- Built own DB with a Hi-Fix model by participating in development of Hi-Fix early on.
- 3D design applied to the main frame and socket guide. Applied a prior verification system for assembly and Z-Stack.

 

 

 

   
 

Hi-Fix Development Specification

   
 
Product Category
DRAM, EDO DRAM, VRAM, SSRAM, SRAM, SDRAM, DDR2, DDR3, DDR3-SDRAM, NAND FLASH, GDDR, GDDR3, GDDR4...
Application System
T5581/H, T5365/P, T5335/P, T5371, T5585, T5591, T5592, T5593, T5377, T5593, T5588, T5503, J995, J996, HS5060R/Q/S, HA6500, AL6090/95, AL6080, AL9341, AL6050, MAGNUM...
Achieves Parallel 16~512 Para
PCB Size / Thickness Customize
PCB Layer ~ 32L
PCB Material
General Purpose : FR-4, PPE, NELCO
Special : Megatron, iSora, Arlon, Rogers
Impedance
50Ω(10%, 7%, 5%), 90Ω(10%), 100Ω(10%)
Special Specifications
BVH, IVH, HPL, Back Drill...

 

 

 

   
 

Raw Material Compare

   
 
Divition N4000-13SI I-TERA MT Megatron-6
Manufacturer NELCO iSora Panasonic
Dk 2Ghz   3.45 3.6
2.5Ghz 3.2    
Df 2Ghz   0.0031 0.002
2.5Ghz 0.008    
Tg TMA 200℃ 210℃(DMA) 210℃
C.T.E X 9~13(PPM/℃) 12(PPM/℃) 15(PPM/℃)
Y 9~13(PPM/℃) 13(PPM/℃) 15(PPM/℃)
Z 3.5% 2.8% 45%
Peel Strength 35㎛ 1.31KN/m 1.0KN/m 0.8KN/m
18㎛     1.1KN/m

 

 

 

 

   
 

Simulation [Signal Integrity & Power Integrity]