PCB Manufacture Performance

	Engineering
	Attributes Layer Count 80L Max. Board Thickness 7.4T Max. Panel Size 610 * 720mm Small Via Hole /Aspect Ratio Standard 26 Advance / Prototype 32 / 41 Trace & Space External (1.5oz) 2.5 / 3.0mil Internal (0.5oz) 2.0 / 2.5mil Pitch Min BGA Pitch 0.25mm Build-Up Via Structure Sequentia Lamination 40-N-4 LVH+IVH Flatness Warpage 0.25mm D2M Drill to Copper 0.3mil

 

 

 

	Handling PCB raw Materials

Maker High Multi Layer Mass Production Under Qual or Plan Under Review Doosan DS7***S(N) DS7***D**(X) DS7***S(F) DS7***H - DS7***9D,DS7***9D(Z) DS7***2D iSola - 3***R, FR**6 FR**8 / HR, IS***i - IS4**, IS6** Panasonic Me*****4 Me*****6 R1***V R1***T Me*****2 Me*****7 R2*** ITEQ - IT18* / A, IT15* IT1**DA IT18*I, IT17**R, IT2***K IT15*D, IT1**DASE/_L tuc - TU72*, TU76* TU8***F, TU8**LF/SLK - TU***K Sp MGC - - H*-6**G F*-2 E*-1**T, E*2-**T F*-7** P N4***-*3/SI N4***-*2/SI N4***-6 N7***-*2HT - N4***-20 ROGERS - RO4***B, RO3*** RO4***C - RO***/6

 

 

 

	LDI(Laser Direct Image)

		Minimum Pattern Width 30㎛ Resolution 2.5㎛ Light Source UV Semiconductor Laser Maximum Product Size 520*620mm Maximum Exposed Area 515*615mm Maximum Product Thickness 3.0mm (Semiautomatic 5.0mm) Characteristic Pattern formation precison is excellent

 

 

 

	Reverse Pulse Rectifier Plating